Peer Reviewed Articles – Shantonu Biswas

Peer-Reviewed Journal Articles

S. Biswas, Y. Shao, T. Hachisu, T. Nguyen-Dnag, Y. Visell. Integrated Soft Optoelectronics for Wearable Health Monitoring, Advanced Materials Technologies, 5, 8, 2000347, (2020). DOI: 10.1002/admt.202000347

In this article, we reported a new manufacturing method for wearable soft health monitoring devices with high integration densities. The method is mostly compatible with existing industrial manufacturing processes. The promise of this method was demonstrated by realizing skin‐interfaced devices for multimodal physiological data capture via multiwavelength optoelectronic sensor arrays.

H. Yufei, S. Biswas, EW Hawkes, T Wang, M Zhu, L. Wen, Y. Visell, A Multimodal, Enveloping Soft Gripper: Shape Conformation, Bioinspired Adhesion, and Expansion-Driven Suction, IEEE Transactions on Robotics, (2020). DOI: 10.1109/TRO.2020.3021427

Here, we presented a fingerless soft gripper capable of efficiently generating multiple grasping modes based on a soft, cylindrical accordion structure containing coupled, parallel fluidic channels. The interior of the gripper was patterned with a gecko-like skin that increases friction, enabling the gripper to lift fragile such and heavy objects. Such devices could improve the ability of robotic systems to meet applications in areas of great economic and societal importance.

S. Biswas, A Schoeberl, Y. Hao, J. Reiprich, T. Stauden, J Pezoldt, H. O. Jacobs, Integrated Multilayer Stretchable Printed Circuit Boards Paving the way for Deformable Active Matrix, Nature Communications, 10, 4909, (2019). DOI: 10.1038/s41467-019-12870-7

This article has attracted great attention and has been featured in several news media. Here, I demonstrated an industry compatible stretchable printed circuit board manufacturing method that enabled multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. A stretchable active matrix with integrated electronic and optoelectronic surface mount devices was shown that could deform reversibly into various 3D shapes, including hemispherical, conical or pyramid.

M. Kaltwasser, U. Schmidt, S. Biswas, T. Stauden, A. Bund, H. O. Jacobs, Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points, Nature Scientific Reports, 9, 1, (2019). DOI: 10.1038/s41598-019-47690-8

Here, we demonstrated fluidic self-assembly of Si-chip on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melting points. The multilayer solder bump was a lead-free ternary solder system, which provided a route to transform the melting point of interconnects for applications in solder directed fluidic self-assembly. The chosen ternary solder system enabled the realization of interconnects with melting points in the range of 112 °C to 206 °C.

S. Biswas, J. Reiprich, T. Stauden, J Pezoldt, H. O. Jacobs, Metamorphic Stretchable Touchpad, Advanced Materials Technologies, 4, 4, 1800446, (2019) DOI: 10.1002/admt.201800446

This article was featured in a few online blogs. Here, I envisioned a metamorphic touchpad, conceptual approach of shape-changing electronics and sensors. I designed and fabricated a multipurpose touchpad able to serve as a flexible, 2D stretchable, and 3D metamorphic device. The metamorphic touchpad could be wrapped around 3D shapes or undergo reversible topological changes from a conventional planar to a hemispheric shape.

S. Biswas, Y. Visell, Emerging Material Technologies for Haptics, Advanced Materials Technologies, 4, 4, 1900042, (2019). DOI: 10.1002/admt.201900042

This highly cited article has attracted significant attention. The sense of touch is involved in nearly all human activities, but information technologies for displaying tactile sensory information to the skin are rudimentary when compared to state‐of‐the‐art video and audio displays, or to tactile perceptual capabilities. In this invited review article, we presented emerging material technologies for the sense of touch, including sensory considerations and requirements, materials, actuation principles, and design and fabrication methods.

M. Kaltwasser, U. Schmidt, S. Biswas, T. Stauden, A. Bund, H. O. Jacobs, Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects, ACS Applied Materials and Interfaces, 10, 47, (2018). DOI: 10.1021/acsami.8b12390

Here, we demonstrated the realization of core-shell transformation-imprinted solder bumps to enable low-temperature chip assembly, while providing a route to high-temperature interconnects through transformation. The bumps enabled fluidic self-assembly and self-alignment at relatively low temperatures (60–80 °C). The tuning of the material ratios leads to tailored transformation-imprinted solders with high melting points (160–206 °C) in the final structure.

S. Biswas, J. Reiprich, J Pezoldt, M. Hein, T. Stauden, H. O. Jacobs, Stress-Adaptive Meander Track for Stretchable Electronics, IOP Flexible and Printed Electronics, 3, 3, (2018). DOI: 10.1088/2058-8585/aad583

In this article, I reported a ‘stress-adaptive‘ stretchable metal track design which varies in width to accommodate the produced torque in the metal track during stretching. The stress-adaptive structure was compared with conventional horseshoe- and U-shaped designs and showed improvements in the stress distribution, levels of twist, a maximum level of elongation (>320%), and required stretch and release cycles (>6000 at 150% elongation) to cause failure in a long term cycling test.

J. Reiprich, M. Gebinoga, L.-P. Traue, L. Schlag, S. Biswas, M. Kaltwasser, M. C. Honecker, T. Stauden, J. Pezoldt, A. Schober, H. O. Jacobs, Localized Collection of Airborne Biological Hazards for Environmental Monitoring, Sensors & Actuators: B. Chemical, 273, (2018). DOI: 10.1016/j.snb.2018.06.129

Here, we presented a robust implementation of an effective “Airborne Analyte Transporter” which (i) permits time-course sampling of airborne particles, (ii) precise localization and concentration of airborne particles at a designated location of a given biosensor (iii) and allows the downstream biological analysis of viable pathogens. The Airborne Analyte Transporter achieved a 1000-fold increase in particle concentration compared to diffusion and settling based transport and allows the precise and local collection of viable pollen, yeasts, spores, bacteria, and virus particles with an additional lateral concentration.

S. Biswas, J. Reiprich, T. Cohrs, D. T. Arboleda, A. Schoeberl, M Mozafari, L. Schlag, T. Stauden, J. Pezoldt, H. O. Jacobs, 3D Metamorphic Stretchable Microphone Arrays, Advanced Materials Technologies, 2, 10, 1700131, (2017). DOI: 10.1002/admt.201700131

This article was nominated as a VIP paper by the reviewers and attracted significant attention, also featured in several news media, including in Science Advances. In this article, I described the realization of a metamorphic microphone array, which can morph from a concave to a planar and then to a convex shape. The morphing array enabled a better (12×) sound source localization when compared to existing static and planar arrangements.

S. Biswas, J. Reiprich, T. Cohrs, T. Stauden, J. Pezoldt, H. O. Jacobs, Metamorphic Hemispherical Microphone Array for Three-Dimensional Acoustics, Applied Physics Letters, 111, 043109, 1-5, (2017). DOI: 10.1063/1.4985710

This article reported a metamorphic stretchable microphone array, which can be inflated by air to morph from a planar to a hemispherical shape. The array undergoes morphological changes to adjust their receive characteristic. The microphone array is used to localize a sound source in a 3D space. The inflated hemispherical microphone array proofs to be better for 3D acoustic localization and/or beam-forming.

S. Biswas, A. Schoeberl, M. Mozafari, J Pezoldt, T. Stauden, H. O. Jacobs, Deformable printed circuit boards that enable metamorphic electronics, Nature Asia Materials, 8, e336, (2016). DOI: 10.1038/am.2016.186

In this iconic article, I pioneered the concept of “metamorphic electronics” that can take on new 3D shapes. We reported a method to produce single-layer deformable and stretchable printed circuit boards and applied to enable the realization of metamorphic electronics. The models contain arrays with packaged surface mount devices and bare dies that integrate LEDs and transistors within a rubber matrix.

S. Biswas, M. Mozafari, T. Stauden, H. O. Jacobs, Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries, Micromachines, 7, 54, (2016). DOI: 10.3390/mi7040054

In this progress report, I discussed an overview and some challenges of surface tension directed fluidic self-assembly of semiconductor chips, which are transported in a liquid medium. The general context is to develop a massively parallel and scalable assembly process to overcome some of the limitations of current methods. The discussion included various assembly methods and assembly of microscopic chips, large-area assembly, and the roll-to-roll assembly process.

S.-C. Park, J. Fang, S. Biswas, M. Mozafari, T. Stauden, H. O. Jacobs, Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications, JMEMS, 24, 6, (2015). DOI: 10.1109/JMEMS.2015.2452772

Here, we presented the implementation of an automated roll-to-roll fluidic self-assembly system based on the surface tension driven self-assembly with applications in the field of macroelectronics. The identification and the modeling of the relationship between process parameters and forces have been studied and experimentally verified by testing the effect of the web angle, agitation on assembly, and detachment rates.

S.-C. Park, S. Biswas, J. Fang, M. Mozafari, T. Stauden, H. O. Jacobs, Millimeter Thin and Rubber-Like Solid-State Lighting Modules Fabricated Using Roll-to-Roll Fluidic Self-Assembly and Lamination, Advanced Materials, 27, 3661-3668, (2015). DOI: 10.1002/adma.201500839

This article attracted great attention, featured in several news media, including in Science. In this article, we reported a millimeter thin rubber‐like solid‐state lighting module fabricated incorporating assembly and electrical connection of light‐emitting diodes (LEDs). The assembly is achieved using roll‐to‐roll fluidic self‐assembly. The LEDs are sandwiched in‐between a stretchable top and bottom electrode to relieve the mechanical stress.

S.-C. Park, J. Fang, S. Biswas, M. Mozafari, T. Stauden, H. O. Jacobs, Automated Reel-to-Reel Fluidic Self-Assembly for the Production of Solid State Lighting Modules, MRS Proceedings, 1761, 1-6, (2015). DOI: 10.1557/opl.2015.679

In this proceeding, we presented the implementation of an automated reel-to-reel fluidic self-assembly system based on surface-tension driven self-assembly. The system enabled the continuous parallel assembly of semiconductor chips at a high rate and assembly yield under optimal condition. It provides a new platform for macroelectronics to enable the integration of microscopic high-performance inorganic semiconductors on flexible substrates with any desired location, pitch, and integration density.

S.-C. Park, J. Fang, S. Biswas, M. Mozafari, T. Stauden, H. O. Jacobs, Self-Assembly: A First Implementation of an Automated Reel-to-Reel Fluidic Self-Assembly Machine, Advanced Materials, 26, 34, (2014). DOI: 10.1002/adma.201470231

Cover image.

S.-C. Park, J. Fang, S. Biswas, M. Mozafari, T. Stauden, H. O. Jacobs, A First Implementation of an Automated Reel-to-Reel Fluidic Self-Assembly Machine, Advanced Materials, 26, 34, (2014). DOI: 10.1002/adma.201401573

This article attracted significant attention, featured as the cover image of the Advanced Materials, and reported in several news media, including Science. In this paper, we demonstrated a first automated roll‐to‐roll fluidic self-assembly process for macroelectronic applications. The system enabled high‐speed assembly of semiconductor dies (15000 chips per hour using a 2.5 cm‐wide web) over large‐area substrates.